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HeatSink Cooling Thermal Paste (Bottle Packing) TSDC0078 non-capacitive

SKU: 85377586305

4.4
USD125.00 USD147.00

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USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 16 - Aug 21

Description

non-capacitive

non-corrosive bleed resistant temp resistant from -50 to 210 C

Ball Size-0

ISL 62882 CHRTZ

non-curing

HeatSink Cooling Thermal Paste (Bottle Packing) TSDC0078 non-capacitiveGenerally used as a thermal coupling of electrical electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers Generally used as a thermal coupling of electrical electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers. It is used for maintaining a positive heat sink seal that improves heat transfer from the electrical electronic component device to the heat sink or

Exchange/Return Notes
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  • Final sale items are not eligible for returns or exchanges.
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