All Hypertec Legacy Modules are fully tested and warrantied under our stringent QA programme and are supplied with a non-dispute lifetime warranty
35 V Memory ranking 2 ECC No Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Memory form factor 204-pin SO-DIMM Memory voltage 1
Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 1 Memory clock speed 1600 MHz Internal memory type DDR3L Features Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 1 Memory clock speed 1600 MHz Internal memory type DDR3L
Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1066 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1066 MHz Internal memory type DDR3
Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3
Hypertec 512MB PC2700 (Legacy) memory module 0.5 GB 1 x 0.5 GB DDR 333 MHz DDR4 All Hypertec Legacy Modules areA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to