Hypertec 67Y0016-HY (Legacy) memory module 4 GB 1 x 4 GB DDR3 1333 MHz SDR SDRAM 2 V Memory ranking 2

2 V Memory ranking 2 ECC No Memory clock speed 3200 MHz Internal memory type DDR4 Weight & dimensions Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Packaging data Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g

A Hypertec® Hyperam® 8GB DDR4-2400 1Rx8 1

Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM CAS latency 10 ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM CAS latency 10 ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 240-pin DIMM CAS latency 10 ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 240-pin DIMM CAS latency 10 ECC No Memory clock speed 1600 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3L Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3L

Hypertec 67Y0016-HY (Legacy) memory module 4 GB 1 x 4 GB DDR3 1333 MHz SDR SDRAM 2 V Memory ranking 2A Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to