Hypertec 256 MB, DIMM 184-PIN, DDR (Legacy) memory module SDR SDRAM Memory Buffered memory type Registered

Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 1 ECC Yes Memory clock speed 1866 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 1 ECC Yes Memory clock speed 1866 MHz Internal memory type DDR3

35 V Memory channels Dual-channel Cooling type Heatsink ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for PC/server Memory form factor 240-pin DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for PC/server Memory form factor 240-pin DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory ranking 2 ECC No Memory clock speed 1600 MHz Internal memory type DDR3L Features Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory ranking 2 ECC No Memory clock speed 1600 MHz Internal memory type DDR3L

Memory Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3 Features Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3

Hypertec 256 MB, DIMM 184-PIN, DDR (Legacy) memory module SDR SDRAM Memory Buffered memory type RegisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to