BSM150GB120DN2-INFINEON First 50 Thermally efficient package construction with

Thermally efficient package construction with isolated baseplate supports direct heatsink mounting and simplified thermal management

many of which are on global shortage

and high-power welding equipment

and continuous load demand place significant stress on switching devices

Housed in a dual (half-bridge capable) configuration

BSM150GB120DN2-INFINEON First 50 Thermally efficient package construction withThe BSM150GB120DN2 is a high performance dual IGBT module from Infineon Technologies, rated for 150 amperes and 1200 volts. Utilizing Infineon's proven non punch through (NPT) IGBT technology, the BSM150GB120DN2 offers excellent switching characteristics, low saturation voltage, and reliable thermal performance. Its robust construction makes it ideal for demanding industrial and energy conversion environments where efficiency and durability are