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250K Qwin 0.50 Leaded Solder ball TSDC0011 Weight: 30g
250K Qwin 0.50 Leaded Solder ball TSDC0011 Weight: 30g
250K Qwin 0.50 Leaded Solder ball TSDC0011 Weight: 30g
250K Qwin 0.50 Leaded Solder ball TSDC0011 Weight: 30g

250K Qwin 0.50 Leaded Solder ball TSDC0011 Weight: 30g

SKU: 13024842080

4.6
USD1063.00 USD1102.00

Pay in 4 interest-free payments of $265.75 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 19 - Aug 24

Description

Weight: 30g

It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis

heat resistance- 220 to 330

When changing the BGA Bridge

non-curing

250K Qwin 0.50 Leaded Solder ball TSDC0011 Weight: 30gBall Size 0. 50 Quantity 250K Melting Range 180 to 205 degree celcius.

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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