Design and Modeling for 3D ICs and Interposers While 52 U

While 52 U

2nd Edition is your essential guide to learning this complex

but not to find nuggets of eternal wisdom

a technical analysis contributor to Futures magazine and an independent trader for twenty-five years

Grote influenced his contemporaries

Design and Modeling for 3D ICs and Interposers While 52 UAuthor: Ki Jin Han Category: Nonfiction Language: English Publisher: WSPC Publication date: November 5, 2013 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as