Wafer Cleaving / Glass Breaking Pliers AFM and Scanning Probe Microscopy Calibration specially formulated adhesive for demanding

specially formulated adhesive for demanding bonding applications such as:

Scanning electron microscopes have a pattern that will show significant differences between backscattered and secondary electron type I and type II images

Typical applications for these tweezers include microscopy preparation

MMTMEC and MTFML DESCRIPTION

For standard grid materials such as Cu

Wafer Cleaving / Glass Breaking Pliers AFM and Scanning Probe Microscopy Calibration specially formulated adhesive for demandingDESCRIPTION These light weight tweezers and pliers are non absorbent, have a positive, gentle grip, are non magnetic and the tips do not open when extra pressure is applied. They resist acetone, alcohol and most acids. Static dissipative (carbon fiber reinforced) versions are available for most models. Ideal for sample preparation, microscopy, etching, electronics, instrumentation, laboratories, forensics and delicate wafer handling. Especially useful