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Ships within 48 hours · Estimated delivery Oct 14 - Oct 19
Designed for use with cerium oxide polishing compound
Available in 6"
Designed for both wet and dry cutting
enhancing blades life and improving operator comfort
Silicon Dioxide (SiO₂): Ideal for brittle materials like glass and ceramics
8" Grooved Polyurethane Cerium Oxide Polishing Pad – Glass & Mirror Finishing Buffing Wheel 5 inch diamond grinding disc Designed for use with ceriumThe LP 66 polyurethane cerium oxide polishing pads are engineered for professionals in lapidary optics, semiconductor, and glass manufacturing who demand uncompromising performance and sub micron precision. Constructed from hydrophobic polyurethane and infused with cerium oxide, the LP 66 Pad delivers rapid material removal while maintaining ultra low friction and heatideal for polishing heat sensitive materials like optical lenses, LCD substrates,
US$ 2350.00
US$ 25.00
US$ 35.95
